Global Organic Substrate Packaging Materials Market Outlook to 2026

DUBLIN, November 24, 2021 / PRNewswire / – The “Organic Substrate Packaging Materials Market: Global Industry Trends, Share, Size, Growth, Opportunity, and Forecast 2021-2026” the report was added to ResearchAndMarkets.com offer.

The global organic substrate packaging materials market has shown moderate growth during the period 2015-2020. Looking ahead, the market is expected to grow at a CAGR of around 5% during 2021-2026. Bearing in mind the uncertainties of COVID-19, the analyst is continuously monitoring and evaluating the direct and indirect influence of the pandemic on different end-use industries. This information is included in the report as a major contributor to the market.

Organic substrate packaging materials are used on the base layer of printed circuit boards (PCBs) to provide high reliability and outstanding electrical performance. These packaging materials reduce the total weight of PCBs and increase their functionality and dimensional control. On top of that, they help minimize the environmental impact of PCBs compared to their inorganic counterparts. Therefore, the demand for organic substrate packaging materials is increasing across the world.

A significant increase in the demand for portable electronic devices, in confluence with advancement in information and communication technologies (ICT), represents one of the key factors driving the growth of the global packaging materials market in organic substrate. Apart from this, the growing popularity of miniature electronic devices in the defense and military, healthcare and aviation industries is positively influencing the sales of these packaging materials around the world.

In addition, the increasing adoption of autonomous vehicles is contributing to the growth of the market as these materials are used in automotive millimeter wave radar systems to detect obstacles. In addition, the growing semiconductor industry, coupled with the growing demand for improved electric motors in industrial equipment, is driving the sales of organic substrate packaging materials around the world. However, due to containment measures imposed by the governments of several countries as a preventive measure to contain the spread of the coronavirus disease (COVID-19), non-essential activities were halted for a short time. This has disrupted the operational efficiency of various industries and has negatively impacted the growth of the market. The market should experience growth once normalcy is restored.

Competitive landscape

The report also analyzed the competitive landscape of the market with some of the major players being Amkor Technology Inc., ASE Kaohsiung (Advanced Semiconductor Engineering Inc.), Compass Technology Co. Ltd., Hitachi Chemical Company Ltd. (Hitachi and Showa Denko), Kyocera Corporation, Mitsubishi Corporation, NGK Spark Plug Co. Ltd., Shinko Electric Industries Co. Ltd. (Fujitsu), STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.) and WUS Printed Circuit Co. Ltd.

Key questions answered in this report

  • How has the global organic substrate packaging materials market performed so far and how will it perform in the years to come?
  • What has been the impact of COVID-19 on the global organic substrate packaging materials market?
  • What are the main regional markets?
  • What is the technology-based market disruption?
  • What is the market split depending on the application?
  • What are the different stages of the industry value chain?
  • What are the main factors and challenges for the industry?
  • What is the structure of the global organic substrate packaging materials market and who are the major players?
  • How competitive is the industry?

Main topics covered:

1 Preface

2 Scope and methodology

3 Executive summary

4 Presentation
4.1 Overview
4.2 Key Industry Trends

5 Global Organic Substrate Packaging Materials Market
5.1 Market overview
5.2 Market performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market breakdown by technology
6.1 Small Outline (SO) packages
6.1.1 Market trends
6.1.2 Market Forecast
6.2 Grid Array (GA) Packages
6.2.1 Market trends
6.2.2 Market Forecast
6.3 Flat lead-free packages
6.3.1 Market trends
6.3.2 Market Forecast
6.4 Quad Flat Kit (QFP)
6.4.1 Market trends
6.4.2 Market Forecast
6.5 Double Package Online (GIP)
6.5.1 Market trends
6.5.2 Market Forecast
6.6 Others
6.6.1 Market trends
6.6.2 Market Forecast

7 Market split by application
7.1 Consumer electronics
7.1.1 Market trends
7.1.2 Market Forecast
7.2 Automotive
7.2.1 Market trends
7.2.2 Market Forecast
7.3 Manufacturing
7.3.1 Market trends
7.3.2 Market Forecast
7.4 Health care
7.4.1 Market trends
7.4.2 Market Forecast
7.5 Others
7.5.1 Market trends
7.5.2 Market Forecast

8 Market breakdown by region

9 SWOT analysis

10 Value chain analysis

11 Analysis of the five forces of carriers

12 Price analysis

13 Competitive landscape
13.1 Market structure
13.2 Key players
13.3 Profiles of key players
13.3.1 Amkor Technology Inc.
13.3.1.1 Company presentation
13.3.1.2 Product portfolio
13.3.1.3 Finances
13.3.1.4 SWOT Analysis
13.3.2 ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)
13.3.2.1 Company overview
13.3.2.2 Product portfolio
13.3.2.3 Finances
13.3.3 Compass Technology Co. Ltd.
13.3.3.1 Company overview
13.3.3.2 Product portfolio
13.3.4 Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)
13.3.4.1 Company overview
13.3.4.2 Product portfolio
13.3.4.3 Finances
13.3.4.4 SWOT Analysis
13.3.5 Kyocera Company
13.3.5.1 Company overview
13.3.5.2 Product portfolio
13.3.5.3 Finances
13.3.5.4 SWOT Analysis
13.3.6 Mitsubishi Corporation
13.3.6.1 Company overview
13.3.6.2 Product portfolio
13.3.6.3 Finances
13.3.6.4 SWOT Analysis
13.3.7 NGK Spark Plug Co. Ltd.
13.3.7.1 Company overview
13.3.7.2 Product portfolio
13.3.7.3 Finances
13.3.8 Shinko Electric Industries Co. Ltd. (Fujitsu)
13.3.8.1 Company overview
13.3.8.2 Product portfolio
13.3.8.3 Finances
13.3.9 STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech Co)
13.3.9.1 Company overview
13.3.9.2 Product portfolio
13.3.9.3 Finances
13.3.9.4 SWOT Analysis
13.3.10 WUS Printed Circuit Co. Ltd.
13.3.10.1 Company overview
13.3.10.2 Product portfolio
13.3.10.3 Finances

For more information on this report, visit https://www.researchandmarkets.com/r/vh0m81

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